Investigation of the initial deposition steps and the interfacial layer of Atomic Layer Deposited (ALD) Al2O3 on Si

30/10/2019

Authors

G.P. Gakis, C. Vahlas, H. Vergnes, S. Dourdain, Y. Tison, H. Martinez, J. Bour, D. Ruch, A.G. Boudouvis, B. Caussat, and E. Scheid

Reference

Applied Surface Science, vol. 492, pp. 245-254, 2019

Description

During the first stages of Atomic Layer Deposition (ALD) of Al2O3 on silicon (Si), the substrate nature affects the surface chemistry, leading to an initial island growth mode. Furthermore, an interfacial zone develops between the Si surface and the dielectric, thus damaging the physical properties of the deposited structure. In this work, these two main shortcomings are investigated for the ALD of Al2O3 films on Si from TMA and H2O. The film and the interfacial zone are characterized by a complete range of techniques, including XRR, TEM, XPS, EDX and ToF-SIMS. In parallel, a computational model is developed to study the initial nucleation and growth steps of the film. An induction period is experimentally evidenced and numerically reproduced, together with the island growth and coalescence phenomena. The chemical composition of the (Al, O, Si) interfacial layer is precisely analyzed to get insight in the mechanisms of its formation. We show that Si oxidation occurs during the island growth, catalyzed by the presence of Al, while it is also fed by species interdiffusion through the ALD film.

Link

doi:10.1016/j.apsusc.2019.06.215

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