Controlled Thermal Debonding of Epoxy Adhesives Using Non-Intumescent Organophosphorus-Based Flame-Retardants
Authors
Kachouri O., Bardon J., Ruch D., Laachachi A.
Reference
Journal of Applied Polymer Science, vol. 142, n° 40, art. no. e57567, 2025
Description
This paper investigates the novel application of an organophosphorus flame retardant, AFLAMMITPCO 900, referred to as the debonding agent, for inducing debonding in adhesive joints. We investigate the performance of a structural adhesive system modified with the debonding agent at various concentrations (0, 10, 20, 30, and 40 wt%). The mechanical properties and thermal/mechanical degradation of these joints were assessed using a modified pull-off test with specific experimental parameters, including surface preparation, adhesive gap, substrate thickness, and curing temperatures. Thermogravimetric analysis (TGA) and differential scanning calorimetry (DSC) were conducted to evaluate the physicochemical properties of the resin samples. Scanning electron microscopy (SEM) was used to analyze the dispersion of the debonding agent in the epoxy matrix and examine the joint microstructure. This study employs tomography to examine the modified resin both before and after reaching the debonding temperature. The results demonstrate that incorporating the debonding agent into adhesive formulations not only lowers the degradation temperature of structural adhesives but also enhances joint strength within the application range. It offers a debonding solution at a distinct temperature window as low as 250°C, promoting efficient end-of-life recycling and advancing sustainable manufacturing practices.
