Superhydrophobicity of direct plasma synthesized and deposited thin films: Effect of chemical-induced and substrate roughness

Authors

Piedrahita C.R., Baba K., Quintana R., Bardon J., Choquet P.

Reference

Applied Surface Science, vol. 659, art. no. 159700, 2024

Description

Surface superhydrophobicity results from combinations of surface free energy and roughness. In this contribution, plasma-induced polymerizations are studied for the direct deposition of coatings with different surface chemistries and topographies. The formation of wrinkles in combination with textured substrates (sandpapers) leads to a transition in the water contact angle (WCA), transforming the substrate from hydrophobic to superhydrophobic (WCA > 150°). Initial correlations of pitch (P), diameter (d), and height (h) of the surface elements in the sandpaper, the chemical-induced roughness and the decrease of wettability are carried out to assist on the design of a plasma etching pre-treatment for substrate texturing. By coating plasma etched silicon wafers, superhydrophobic surfaces are produced with WCA values around 168° and hysteresis (HA) and tilting angles as low as 5°.

Link

doi:10.1016/j.apsusc.2024.159700